Patent 12088896 was granted and assigned to Kyocera Corporation on September, 2024 by the United States Patent and Trademark Office.
An electronic device has an electronic component, a substrate on which the electronic component is mounted, and a housing having a tubular shape. The housing includes a first metal plate that is a tubular metal plate covering the electronic component and the substrate from the outer peripheral direction of the substrate and a second metal plate that is a tubular metal plate joined to the first metal plate from the radially inner side, a portion of each of the first metal plate and the second metal plate being covered with resin.