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US Patent 12092861 Photonic semiconductor device and method of manufacture
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Patent
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Date Filed
July 15, 2020
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Date of Patent
September 17, 2024
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Patent Application Number
16929799
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Patent Citations
US Patent 11415745 Systems, devices, and methods for improved optical waveguide transmission and alignment
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US Patent 11362077 Photonic semiconductor device and method
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US Patent 11367711 Optically interfaced stacked memories and related methods and systems
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US Patent 9482816 Radiation coupler
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US Patent 9874690 Integrated waveguide structure with perforated chip edge seal
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US Patent 9910232 Method and system for a chip-on-wafer-on-substrate assembly
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US Patent 10578799 Co-packaging photonic integrated circuits and application specific integrated circuits
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US Patent 10606003 Method and system for an optical coupler for silicon photonics devices
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US Patent 10795079 Methods for optical dielectric waveguide subassembly structure
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US Patent 10873399 Method and system for a photonic interposer
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•••
Patent Inventor Names
Hsing-Kuo Hsia
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Chen-Hua Yu
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
12092861
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Patent Primary Examiner
Michelle R. Connelly-Cushwa
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CPC Code
G02B 6/4214
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G02B 6/4274
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G02B 6/428
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H04B 10/801
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G02B 6/30
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H04Q 11/0005
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H04Q 2011/0035
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G02B 6/12004
0
H04B 10/807
0
G02B 6/4206
0
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