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US Patent 12094750 Tape heating methods

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Michael J. Seddon0

Date of Patent

September 17, 2024

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Patent Application Number

171361830

Date Filed

December 29, 2020

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Patent Citations

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US Patent 10896840 Tape heating methods

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US Patent 7696067 Method of manufacturing device

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US Patent 7968977 Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same

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US Patent 8587130 Die-sorting sheet and method for transporting chips having adhesive layer

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Patent Primary Examiner

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CPC Code

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H01L 2221/68327

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Patent abstract

Implementations of a method of increasing the adhesion of a tape. Implementations may include: mounting a tape to a frame, mounting a substrate to the tape, heating the tape after mounting the substrate at one or more temperatures for a predetermined period of time, and increasing an adhesion of the tape to the substrate through heating the tape.

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