Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yu Chao Lin0
Bo-Jiun Lin0
Tung Ying Lee0
Date of Patent
September 17, 2024
0Patent Application Number
178839860
Date Filed
August 9, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
An embodiment is a method including forming an opening in a mask layer, the opening exposing a conductive feature below the mask layer, forming a conductive material in the opening using an electroless deposition process, the conductive material forming a conductive via, removing the mask layer, forming a conformal barrier layer on a top surface and sidewalls of the conductive via, forming a dielectric layer over the conformal barrier layer and the conductive via, removing the conformal barrier layer from the top surface of the conductive via, and forming a conductive line over and electrically coupled to the conductive via.
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