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US Patent 12094851 Particle capture using transfer stamp

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
April 7, 2023
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Date of Patent
September 17, 2024
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Patent Application Number
18132199
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Patent Citations
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US Patent 10899067 Multi-layer stamp
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US Patent 11652082 Particle capture using transfer stamp
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US Patent 6979032 Vacuum pick-up head with vacuum supply valve
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US Patent 7354801 Method for manufacturing semiconductor device
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US Patent 7622367 Methods and devices for fabricating and assembling printable semiconductor elements
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US Patent 7964439 Methods of fabricating devices by transfer of organic material
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US Patent 8506867 Printing semiconductor elements by shear-assisted elastomeric stamp transfer
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US Patent 8889485 Methods for surface attachment of flipped active componenets
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US Patent 9087764 Adhesive wafer bonding with controlled thickness variation
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US Patent 9105714 Stabilization structure including sacrificial release layer and staging bollards
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•••
Patent Inventor Names
Ronald S. Cok
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12094851
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Patent Primary Examiner
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Vu A Vu
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CPC Code
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H01L 21/6835
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H01L 2221/68368
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H01L 2224/75303
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H01L 24/83
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H01L 21/67144
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B41F 16/0046
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H01L 25/0753
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H01L 21/67092
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