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US Patent 12096551 Trans-vacuum printed flexible wiring apparatus

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
June 8, 2022
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Date of Patent
September 17, 2024
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Patent Application Number
17834971
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Patent Citations
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US Patent 11425841 Using thermalizing material in an enclosure for cooling quantum computing devices
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US Patent 10785891 Superconducting computing system in a liquid hydrogen environment
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US Patent 8441329 Input/output system and devices for use with superconducting devices
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Patent Inventor Names
Hans Haenlein
0
Ali Esmailiyan
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Dirk Robert Walter Leipold
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12096551
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Patent Primary Examiner
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Roshn K Varghese
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CPC Code
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H05K 1/189
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H05K 2201/0154
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H05K 2201/0715
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H05K 2201/09681
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H05K 2201/10189
0
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H05K 2201/10356
0
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H05K 2201/09027
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H05K 2201/09081
0
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H05K 2201/09
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H05K 2201/09009
0
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