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US Patent 12108531 Circuit board comprising via

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
November 26, 2020
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Date of Patent
October 1, 2024
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Patent Application Number
17756541
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Patent Citations
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US Patent 10448501 Circuit structure
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US Patent 10531577 Forming through holes through exposed dielectric material of component carrier
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US Patent 11452212 Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially
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US Patent 9516753 Wiring substrate and method for manufacturing wiring substrate
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US Patent 9538664 Wiring substrate
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US Patent 10321566 Printed wiring board and method of manufacturing the same
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US Patent 10440835 Forming through holes through exposed dielectric material of component carrier
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US Patent 6972382 Inverted microvia structure and method of manufacture
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US Patent 9433093 High strength through-substrate vias
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Patent Inventor Names
Jin Hak Lee
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Kyo Hun Koo
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In Ho Jeong
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12108531
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Patent Primary Examiner
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Timothy J Thompson
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CPC Code
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H05K 2203/1572
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H05K 2201/0338
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H05K 3/425
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H05K 2203/1476
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H05K 1/115
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H05K 3/423
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H05K 1/0206
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H05K 1/0218
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H05K 1/111
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H05K 3/108
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