US Patent 12108563 Power electronics assemblies having embedded power electronics devices

Power electronics assemblies having embedded power electronics devices are disclosed. In one embodiment, a power electronics assembly includes a circuit board assembly that includes a substrate that is electrically insulating and a power electronics device assembly embedded in the substrate. The power electronics device assembly includes an S-cell that includes an inner graphite layer, a metal layer encasing the inner graphite layer, and a first surface of the metal layer comprising a recess provided within the first surface. The power electronics device assembly further includes a power electronics device disposed within the recess of the first surface.