Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Reinhold Sussmann0
Matthias Hartmann0
Mauro Bonin0
Date of Patent
October 8, 2024
0Patent Application Number
175592200
Date Filed
December 22, 2021
0Patent Citations
Patent Primary Examiner
Patent abstract
A method of using a marriage mold includes providing an upper plate having a first wall and at least one second wall, and a lower plate having a marriage cavity and a top wall. At least two midsole components are provided, which are made of a first material, and each have a first region and a void structure. The at least two midsole components are positioned into the marriage cavity. The upper plate is secured to the lower plate such that the first wall and the top wall form a seal. The at least two midsole components are joined together to form a midsole having a second void structure.
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