Patent attributes
Methods and apparatus for prosing a sensor IC package having first and second sets of magnetic field sensing elements and a third set of magnetic field sensing elements located between the first and second positions, wherein the first, second, and third sets of magnetic field sensing elements have a first axis of sensitivity and a second axis of sensitivity, wherein the first and second axes of sensitivity are orthogonal. The sensor IC package is positioned in relation to a target comprising a two-pole magnet and the first and second axes of sensitivity are perpendicular to an axis about which the target rotates. Differential signals are processed to determine an absolute position of the target. A first secondary angle position is generated from the first and third sets of magnetic field sensing elements.
