Patent 12114120 was granted and assigned to Yamaha Corporation on October, 2024 by the United States Patent and Trademark Office.
An earphone housing includes an inserter to be inserted into an outer ear hole, and a main body to be coupled to the inserter. The main body includes a bottom surface to contact a surface of a cavum concha, and a side surface to contact a tragus and an antitragus. The side surface includes a depressed part depressed inward and contacting a top of the antitragus, and the side surface contacts the tragus at a part other than the depressed part.