Patent attributes
This invention relates to a microelectromechanical loudspeaker implemented as a system-on-chip or system-in-package. The microelectromechanical loudspeaker includes a microelectromechanical sound-generating device implemented in a microelectromechanical system (MEMS) and a microphone mounted on the cover or integrated in the cover, wherein the microphone is positioned adjacent to one of the sound outlet openings of the cover. The MEMS comprises a cavity formed between a planar cover, a planar base and circumferential sidewalls provided between the cover and the base. The MEMS further comprises a plurality of movable actuators for generating sound. The actuators are provided in the cavity between the cover and the base, and wherein the cover and the base have a plurality of sound outlet openings to emit sound in a direction transverse to the cover and the base, respectively.
