Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chi-Lung Chen0
Date of Patent
October 15, 2024
0Patent Application Number
181735760
Date Filed
February 23, 2023
0Patent Citations
Patent Primary Examiner
Patent abstract
A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.