Patent attributes
A method of producing inductive sensors, including LVDTs and inductive encoders, manufactured by plotting fine wire onto a planar substrate. A sensor is constructed using a computer-controlled machine to place wire onto a planar adhesive substrate. This substrate forms a predictable and uniform surface to deposit each turn of wire, and so the placement accuracy is considerably better than conventional coil winding. This planar substrate can then be manipulated into a desired three-dimensional shape (e.g., by folding, rolling, corrugating, winding, etc.), carrying the wire along with it. In particular, the same CNC machine used to place the wire can be used to cut, crease, score, or otherwise pattern the substrate to facilitate the three-dimensional arrangement.
