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US Patent 12125748 Contact plug

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 20, 2022
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Date of Patent
October 22, 2024
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Patent Application Number
17868927
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Patent Citations
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US Patent 9613856 Method of forming metal interconnection
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US Patent 9716032 Via-free interconnect structure with self-aligned metal line interconnections
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US Patent 9972529 Method of forming metal interconnection
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US Patent 10083863 Contact structure for semiconductor device
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US Patent 10170322 Atomic layer deposition based process for contact barrier layer
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US Patent 10163691 Low-K dielectric interconnect systems
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US Patent 10177038 Prevention of contact bottom void in semiconductor fabrication
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US Patent 9252019 Semiconductor device and method for forming the same
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US Patent 9520362 Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components
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Patent Inventor Names
Chih-Hsuan Lin
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Xi-Zong Chen
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Chih-Teng Liao
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12125748
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Patent Primary Examiner
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Dale E Page
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CPC Code
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H01L 21/76814
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H01L 21/76804
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H01L 21/76831
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H01L 21/76843
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H01L 21/76855
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H01L 21/76865
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H01L 21/76805
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H01L 21/823431
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H01L 21/76816
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H01L 21/76835
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