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US Patent 12127335 Electronic device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
February 24, 2022
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Date of Patent
October 22, 2024
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Patent Application Number
17680069
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Patent Citations
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US Patent 8030750 Semiconductor device packages with electromagnetic interference shielding
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US Patent 8276268 System and method of forming a patterned conformal structure
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US Patent 9949377 Electronic devices with internal moisture-resistant coatings
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US Patent 10242957 Compartment shielding in flip-chip (FC) module
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US Patent 10985109 Shielded semiconductor packages with open terminals and methods of making via two-step process
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US Patent 10937741 Molded laser package with electromagnetic interference shield and method of making
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US Patent 11605571 Package comprising a substrate, an integrated device, and an encapsulation layer with undercut
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US Patent 7161092 Apparatus and method for protecting an electronic circuit
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US Patent 8004860 Radiofrequency and electromagnetic interference shielding
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Patent Inventor Names
Chang-Fu Lu
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Pai-Sheng Shih
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Wei-Jhen Ciou
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Jenchun Chen
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12127335
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Patent Primary Examiner
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Tuan T Dinh
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CPC Code
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H01L 21/6835
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H05K 9/0024
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H05K 3/284
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H05K 1/18
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