US Patent 12131795 Adaptive temperature compensation for a memory device

A first analysis of each respective die of a multi-die memory device is performed. An equation to determine a respective temperature compensation (tempco) value for each respective die based on a number of program erase cycles (PECs) of the respective die based on the first analysis s determined. The equation for use in processing memory access requests directed to the respective die is stored. Whether to update the equation directed to the respective die based on a second analysis of the respective die is determined.