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US Patent 12133365 Cooling system and methods

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
June 25, 2022
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Date of Patent
October 29, 2024
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Patent Application Number
17808995
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Patent Citations
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US Patent 7738249 Circuitized substrate with internal cooling structure and electrical assembly utilizing same
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US Patent 10356891 Printed circuit board and solid state drive apparatus having the same
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US Patent 10361143 Apparatus and method for reconfigurable thermal management using flow control of liquid metal
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US Patent 10431475 Cold plate with dam isolation
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US Patent 10512152 Device array backframe with integral manifolding for high performance fluid cooling
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US Patent 10548215 Flexible printed circuit, method for fabricating the same, and display device
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US Patent 10660199 Microfluidic channels and pumps for active cooling of circuit boards
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US Patent 10665526 Component carrier comprising at least one heat pipe and method for producing said component carrier
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US Patent 10699986 Cooled electronics package with stacked power electronics components
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US Patent 10746475 Multi-phase thermal control apparatus, evaporators and methods of manufacture thereof
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•••
Patent Inventor Names
Cody Hubman
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Justin Eugene Evans
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Shuaib Badat
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12133365
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Patent Primary Examiner
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Lee A Holly
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CPC Code
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F28F 3/12
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F28D 2021/0029
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F28D 15/0283
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F28D 15/025
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F28D 1/047
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H05K 7/20418
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H05K 7/20327
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H05K 7/20336
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B23P 15/26
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B23P 11/025
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•••

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