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US Patent 12133367 PCB heat dissipation assembly and server having same

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

121333670

Patent Inventor Names

Xudong Wang0

Xuesong Zhou0

Shuhao Zhang0

Jianjun Pan0

Shizhen Liao0

Date of Patent

October 29, 2024

Patent Application Number

176366440

Date Filed

October 31, 2019

Patent Citations

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US Patent 7760498 Electronic apparatus with air guiding element

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US Patent 10602639 Extension portion of heatsink above a processing component

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US Patent 7120018 Mother board with a ventilation-enhancing member

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US Patent 8776833 Air duct for electronic device

Patent Primary Examiner

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Courtney L Smith

Patent abstract

Disclosed are a PCB heat dissipation assembly (

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