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US Patent 12136565 Semiconductor device package and manufacturing method thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
August 19, 2022
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Date of Patent
November 5, 2024
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Patent Application Number
17891341
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Patent Citations
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US Patent 8288201 Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die
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US Patent 8796072 Method and system for a semiconductor device package with a die-to-die first bond
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US Patent 10283400 Semiconductor device package and manufacturing method thereof
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US Patent 9966300 Semiconductor device package and manufacturing method thereof
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US Patent 11424155 Semiconductor device package and manufacturing method thereof
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US Patent 7335972 Heterogeneously integrated microsystem-on-a-chip
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US Patent 7977802 Integrated circuit packaging system with stacked die and method of manufacture thereof
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Patent Inventor Names
David Jon Hiner
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Ronald Patrick Huemoeller
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Michael G. Kelly
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Won Chul Do
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12136565
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Patent Primary Examiner
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Dale E Page
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CPC Code
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H01L 25/50
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H01L 23/481
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H01L 2224/97
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H01L 2924/19105
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