US Patent 12136613 Chip package with near-die integrated passive device
Patent 12136613 was granted and assigned to Xilinx Inc on November, 2024 by the United States Patent and Trademark Office.
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US Patent 12136613 Chip package with near-die integrated passive device
Article
Patent abstract
A chip package and method for fabricating the same are provided that includes a near-die integrated passive device. The near-die integrated passive device is disposed between a package substrate and an integrated circuit die of a chip package. Some non-exhaustive examples of an integrated passive device that may be disposed between the package substrate and the integrated circuit die include a resistor, a capacitor, an inductor, a coil, a balum, or an impedance matching element, among others.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hong Shi0
Li-Sheng Weng0
Suresh Ramalingam0
Date of Patent
November 5, 2024
0Patent Application Number
176692520
Date Filed
February 10, 2022
0Patent Citations
Patent Primary Examiner
CPC Code
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