US Patent 6841418 Multi-substrate microelectronic packages and methods for manufacture
Patent 6841418 was granted and assigned to Micron Technology on January, 2005 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
January 28, 2004
0
Date of Patent
January 11, 2005
0
Patent Application Number
10767290
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Patent Inventor Names
Boon Suan Jeung
0
Chia Yong Poo
0
Low Siu Waf
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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