US Patent 6848162 System and method of transferring dies using an adhesive surface

A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. The second surface is positioned to be closely adjacent to the first surface that has a plurality of dies attached thereto. A distance is reduced between the first surface and the second surface until the plurality of dies contact the second surface and attach to the second surface due to an adhesiveness of the second surface. The first surface and second surface are moved apart. The plurality of dies remain attached to the second surface.