Is a
Patent attributes
Patent Applicant
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Raymond T. Galasco0
Anita Sargent0
Roy H. Magnuson0
Thomas R. Miller0
Voya R. Markovich0
William E. Wilson0
Date of Patent
February 8, 2005
0Patent Application Number
102536790
Date Filed
September 24, 2002
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A colloidal metal seed formulation useful for catalytically activating a surface of a non-conductive dielectric substrate in an electroless plating process is provided. The colloidal metal seed formulation includes stannous chloride, palladium chloride, HCl and a surfactant selected from a diphenyloxide disulfonic acid or alkali or alkaline earth metal salt thereof, C30H50O10, an alcohol alkoxylate and mixtures thereof. A method of electroless plating of a conductive metal onto a non-conductive dielectric substrate using the colloidal metal seed formulation is also provided.
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