US Patent 6852564 Semiconductor device and method of fabricating the same
Patent 6852564 was granted and assigned to Oki Electric Industry on February, 2005 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor device is disclosed which includes a semiconductor chip having a plurality of electrode pads on its upper surface; terminals such as copper posts formed on the upper surface of the semiconductor chip, and electrically connected to each of the electrode pads; a resin deposited on the upper surface of the semiconductor chip, encapsulating the terminals but exposing at least some of them to a predetermined height; and electroconductor members such as solder balls connected to the terminals. There is also disclosed a method of fabricating such a semiconductor device.
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Patent Inventor Names
Harufumi Kobayashi0
Shinji Ohuchi0
Yasushi Shiraishi0
Date of Patent
February 8, 2005
0Patent Application Number
103047670
Date Filed
November 27, 2002
0Patent Primary Examiner
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US Patent 6852564 Semiconductor device and method of fabricating the same
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