Is a
Patent attributes
Patent Applicant
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ognjen Djekic0
Date of Patent
February 8, 2005
0Patent Application Number
101540260
Date Filed
May 22, 2002
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package has a printed circuit board, an integrated circuit chip on the printed circuit board with an exposed semiconductor die, and a rigid structure secured to the printed circuit board and enclosing the exposed semiconductor die. The exposed surface of the semiconductor die placed is in thermal contact with an inner surface of the rigid structure with a compressible material.
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