US Patent 6864573 Two piece heat sink and device package
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Patent abstract
A two piece electronic component heat sink and device package comprising a first piece configured to retain electronic components, and a second piece having a hinge region configured to moveably connect the second piece to the first piece, and a snap lock region opposite the hinge region, the snap lock region configured to secure the second piece to the first piece. A two piece electronic component heat sink and device package for a circuit board comprising: a first piece having an index slot for retaining said circuit board, and a second piece having a hinge region configured to pivotably connect the second piece and the first piece, and a snap lock region configured to secure the second piece to the first piece.
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Patent Inventor Names
Gary L Brown0
Michael F Robertson0
Date of Patent
March 8, 2005
0Patent Application Number
104305550
Date Filed
May 6, 2003
0Patent Primary Examiner
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US Patent 6864573 Two piece heat sink and device package
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