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US Patent 6866807 High-precision modeling filament

Patent 6866807 was granted and assigned to Stratasys on March, 2005 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Stratasys
Stratasys
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Date Filed
April 17, 2002
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Date of Patent
March 15, 2005
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Patent Application Number
10124241
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Patent Citations Received
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US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables
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US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential
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US Patent 11958162 CMP pad construction with composite material properties using additive manufacturing processes
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US Patent 11878389 Structures formed using an additive manufacturing process for regenerating surface texture in situ
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US Patent 12023853 Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
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US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods
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Patent Inventor Names
Robert L. Skubic
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James W. Comb
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John Samuel Batchelder
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Paul J. Leavitt
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William R. Priedeman, Jr.
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
6866807
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Patent Primary Examiner
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Mark Eashoo
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