US Patent 6869499 Substrate processing method and substrate processing apparatus
Patent 6869499 was granted and assigned to Tokyo Electron on March, 2005 by the United States Patent and Trademark Office.
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Patent abstract
After semiconductor wafers W have been processed with ozone gas and steam fed into a processing vessel 10, air is fed into the processing vessel 10 from an air supply source connected to an ozone gas supply pipe 42 for feeding ozone gas into the processing vessel 10, whereby an atmosphere of the ozone gas in the processing vessel 10 is replaced with an atmosphere of the air.
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Patent Inventor Names
Naoki Shindo0
Tadashi Iino0
Takayuki Toshima0
Date of Patent
March 22, 2005
0Patent Application Number
101574450
Date Filed
May 28, 2002
0Patent Primary Examiner
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US Patent 6869499 Substrate processing method and substrate processing apparatus
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