Is a
Patent attributes
Patent Applicant
0
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Christine Hau-Riege0
Stefan Hau-Riege0
Date of Patent
March 22, 2005
0Patent Application Number
106721520
Date Filed
September 25, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method is provided for forming a wafer stack. This may include providing a first wafer having a first plurality of metalized trenches on a surface of the first wafer. A second wafer may be provided having a second plurality of metalized trenches on a surface of the second wafer facing the first wafer. The first plurality of metalized trenches may be solder bonded to the second plurality of metalized trenches.
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