Is a
Patent attributes
Patent Applicant
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Christian Goebl0
Date of Patent
March 22, 2005
0Patent Application Number
104013870
Date Filed
March 27, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The invention provides a power semiconductor module including a power converter module with an improved configuration technology that minimizes or eliminates the need for a positive bonding (soldering/adhesive) connection between a power semiconductor element and a contact surface of a substrate. The present invention includes a housed or encapsulated power semiconductor element with a pre-secured connecting element that reduces manufacturing time and costs, while improving performance capability in a decreased size.
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