Is a
Patent attributes
Patent Applicant
0
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
John F. McMahon0
Date of Patent
May 10, 2005
0Patent Application Number
097685800
Date Filed
January 23, 2001
0Patent Citations Received
0
Patent Primary Examiner
Patent abstract
A multi-chip package and a method of manufacturing the same. The multi-chip package of the present invention has a plurality of shelves. A first semiconductor is electrically coupled to at least one of the package's shelves. A second semiconductor die is electrically coupled to at least one of the package's shelves, wherein the second semiconductor die is above said first semiconductor die.
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