Is a
Patent attributes
Patent Applicant
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chun Ho Fan0
Geraldine Tsui Yee Lin0
John Ping Sheung Lau0
Neil McLellan0
Date of Patent
June 7, 2005
0Patent Application Number
106606120
Date Filed
September 12, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A process for reworking or dressing a saw blade used in wafer dicing and singulation of molded array integrated circuit packages, includes rotating the saw blade on a spindle and ablating an edge portion of the saw blade using a laser and thereby dressing the saw blade.
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