US Patent 6908565 Etch thinning techniques for wafer-to-wafer vertical stacks
Patent 6908565 was granted and assigned to Intel on June, 2005 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 24, 2002
0
Date of Patent
June 21, 2005
0
Patent Application Number
10328958
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Patent Citations Received
Patent Inventor Names
R. Scott List
0
Sarah E. Kim
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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