US Patent 6922324 Remote powering of electrostatic chucks

Substrates such as silicon wafers, flat panel displays, and hard disk drive head substrates are electrostatically gripped using power derived from a physically separated source. Noncontacting coupling permits operation in vacuum as a result of its efficient energy conversion. Bidirectional communications between a controller and the remote gripper electronics along its power coupling lines is enabled. Inclusion of a communications link allows monitoring of system status and full control over the substrate sensing, grip, and release processes. The system of the present invention provides freedom from rf bias filtering considerations, and enables installation of grippers on robot arms without stretching, bending, or sliding electrical connections.