Is a
Patent attributes
Patent Applicant
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Keiji Minetani0
Yoji Suzuki0
Date of Patent
August 16, 2005
0Patent Application Number
103018160
Date Filed
November 22, 2002
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A high frequency semiconductor device including a high frequency semiconductor chip, comprising an active region provided on a front face side of the high frequency semiconductor chip; a covering electrode provided on the active region and connected to a ground potential; and a back face wiring provided on a back face side of the high frequency semiconductor chip. The back face wiring forms a high frequency transmission line together with the covering electrode functioning as a high frequency ground plate. A front face wiring may be provided on the front face side of the high frequency semiconductor chip to form a high frequency transmission line together with the covering electrode.
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