US Patent 6932618 Mezzanine integrated circuit interconnect

An interconnect assembly to electrically interconnect one or more integrated circuits to an electronic device may comprise a base package to couple to a circuit board of the electronic device. A terminal mezzanine package may support the integrated circuit(s) above the base package. A first set of conductors of a first material and design carry low-frequency signals between the base and terminal connector packages. A second set of conductors of a second material and design carry high-frequency signals. In particular embodiments the base package may comprise a base mezzanine integrating one or more additional integrated circuits and intermediate mezzanines supporting one or more additional integrated circuits each and enabling multi-story modular interconnection structures. In particular embodiments, the second set of conductors may comprise columns of compressible polymer compound embedded with metallized particles, and the columns may be dispersed amongst pins and sockets of a pin-grid array.