Is a
Patent attributes
Patent Applicant
0
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Keisuke Saito0
Johji Kagami0
Rikiya Kato0
Sakie Yamagata0
Tadatomo Suga0
Tatsuya Takeuchi0
Yoshikazu Matsuura0
Date of Patent
August 30, 2005
0Patent Application Number
104135640
Date Filed
April 15, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of active components, so it is not necessary to perform cleaning after soldering to remove flux residue.
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