US Patent 6942156 Noncontact IC card
Patent 6942156 was granted and assigned to Sony on September, 2005 by the United States Patent and Trademark Office.
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Patent abstract
In an IC card, an IC module constructed by mounting an IC chip and an antenna circuit on a substrate is sandwiched between at least a pair of exterior films. The IC chip is sealed with resin on its outside and reinforced by a reinforcement material having a substantially circular shape with a diameter greater than a longest dimension value of the IC chip. The height variation amount of the shape of the reinforcement material on a surface thereof is within a range of 20 μm or less. The reliability of the IC chip is ensured while the outer appearance of the card and print characteristic are not degraded.
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Patent Inventor Names
Eiji Ohta0
Norihiko Yamazaki0
Shinichi Matsumura0
Date of Patent
September 13, 2005
0Patent Application Number
101820850
Date Filed
November 22, 2001
0Patent Primary Examiner
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US Patent 6942156 Noncontact IC card
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