US Patent 6942893 Densifying hollow porous substrates by chemical vapor infiltration

A porous substrate having a concave inside face and an outside face is disposed in an enclosure, and reactive gas is introduced into the enclosure to densify the substrate. At least a portion of the gas is divided into two non-zero fractions. The first fraction of the gas is fed to the inside face of the substrate. The second fraction of the gas is fed to only the outside face of the substrate. Alternatively, the first fraction of the gas is fed via a tooling extending into an inside volume defined by the concave inside face of the substrate.