Is a
Patent attributes
Patent Applicant
0
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Todd A. Krinke0
Date of Patent
September 20, 2005
0Patent Application Number
102646350
Date Filed
October 4, 2002
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for manufacturing an integrated lead suspension or component having an integrated circuit (IC) with an array of terminals. The suspension or component is formed from a laminated sheet of material including a spring metal layer and a conductive material layer separated by an insulating layer. The method includes forming an IC window in the spring metal layer, forming integrated conductive leads in the conductive material layer and forming holes in the insulating layer. The IC can then be mounted to the suspension or component in the IC window, and the array of terminals electrically interconnected to the integrated conductive leads through the insulating layer.
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