Patent attributes
An FPGA is readily connectable to a high-speed fiber optic link by snap fitting an external fiber optic cable into an accommodating duplex fiber optic connector of a low-profile packaged FPGA integrated circuit. The low-profile packaged FPGA integrated circuit includes a die-bonded assembly disposed within a co-fired multilayer ceramic integrated circuit package. The die-bonded assembly includes the optoelectronic die, the bottom surface of which is die-bonded and electrically interconnected by micropads to the upper surface of the core of an FPGA integrated circuit die. A first optical fiber communicates light from the connector, through the package, and to a photodetector on the optoelectronic die. A second optical fiber communicates light from a laser diode on the optoelectronic die, through the package, and to the connector. In some embodiments, a micromirror device is disposed within the package to redirect light between the optoelectronic die and the optical fibers.
