Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenneth A. Peterson0
Date of Patent
October 18, 2005
0Patent Application Number
106065250
Date Filed
June 26, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a “package first, release later” manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.
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