Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hermes T. Apale0
Il Kwon Shim0
Virgil C. Ararao0
Date of Patent
November 1, 2005
0Patent Application Number
109148700
Date Filed
August 9, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An embodiment of the present invention allows mold compound to flow underneath a substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities where the mold compound will remain in place and harden. After hardening, the mold compound surrounding a mold anchor will support an anchored area.
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