A device for application of a liquid gluing system comprising at least two components, such as a resin component and a hardener component, the device comprising at least two hollow members (11, 11′), each member being provided with a row of orifices designed to apply the respective components onto a substrate (6) below the hollow members (11, 11′), and at least two trays (2, 2′) one tray below each of the hollow members to receive surplus of the respective component not being applied onto the substrate, wherein the hollow members (11, 11′) are adapted to be placed in the respective tray (2, 2′) having the orifices below the level of the liquid in the tray. A method for avoiding plugging of the orifices in the hollow member during a stop in application is also described.