Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Huang Meng-Cheng0
Lin Ming-Yang0
Date of Patent
December 27, 2005
0Patent Application Number
104370080
Date Filed
May 14, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
