US Patent 6982487 Wafer level package and multi-package stack
Is a
Date Filed
September 22, 2003
0
Date of Patent
January 3, 2006
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Patent Application Number
10665630
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Patent Inventor Names
Hyeong-Seob Kim
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Tae-Gyeong Chung
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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