Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Il Kwon Shim0
Byung Hoon Ahn0
Ming Ying0
Seng Guan Chow0
Date of Patent
February 28, 2006
0Patent Application Number
107737160
Date Filed
February 5, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A system is provided for an integrated circuit package including a leadframe having a lead finger. A groove is formed in a lead finger for a conductive bonding agent and a passive device is placed in the groove to be held by the conductive bonding agent.
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