Patent attributes
A swaging machine is configured to substantially uniformly reduce the diameter of a tubular attachment, such as a marker band, to result in a smooth and repeatable finished part. The swaging machine comprises a feed system, an impact system, and a rotation system. A split die having a compound die cavity is provided for use in conjunction with the swaging machine to receive an impact force from the impact system and, in turn, apply a swaging force to the marker band. The rotation system rotates the impact system, including the die, about the axis of the marker band to apply swaging forces about the circumference of the marker band, while the feed system feeds the marker band through the die thereby applying swaging forces along the length of the marker band.
