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US Patent 7015075 Die encapsulation using a porous carrier
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Patent
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Date Filed
February 9, 2004
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Date of Patent
March 21, 2006
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Patent Application Number
10774977
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Patent Citations Received
US Patent 11855023 Wafer level fan out semiconductor device and manufacturing method thereof
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US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof
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US Patent 12009343 Stackable package and method
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Patent Inventor Names
Kevin R. Lish
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Craig S. Amrine
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Owen R. Fay
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
7015075
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Patent Primary Examiner
Maria F. Guerrero
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